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Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. To begin with, a thorough introductory section acquaints readers with the fundamentals of wafer bonding and the challenges facing this key technology. In the second part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The third and final part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
Dr. Peter Ramm is head of the department Device and 3D Integration of Fraunhofer EMFT in Munich, Germany, where he is responsible for process integration of innovative devices and heterogeneous systems with a specific focus on 3D integration technologies. Dr. Ramm received the physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing for over two decades on 3D integration technologies. Peter Ramm is author or co-author of over 100 publications and 24 patents. He received the "Ashman Award 2009" from the International Electronics Packaging Society (IMAPS) "For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies". Peter Ramm is Fellow and Life Member of IMAPS, organizing committee member of IEEE 3DIC conference and co-editor of Wiley?s "Handbook of 3D Integration".
Dr. James Jian-Qiang Lu received his Dr. rer. nat. (Ph.D.) degree from Technical University of Munich, and is currently an Associate Professor in Electrical Engineering at Rensselaer Polytechnic Institute (RPI), Troy, NY. Dr. Lu has worked on 3D hyper-integration technology, design and applications for over a decade, with focus on hyper-integration and micro-nano-bio interfaces for future chips. He has more than 200 publications in the areas from micro-nano-electronics theory and design to materials, processing, devices, integration and packaging. He is an IEEE Fellow for contributions to three-dimensional integrated circuit technology, and a Fellow and Life Member of International Microelectronics and Packaging Society (IMAPS). He is a recipient of the 2008 IEEE CPMT Exceptional Technical Achievement Award for his pioneering contributions to and leadership in 3D integration/packaging and the 2010 IMAPS William D. Ashman Achievement Award for contributions and research in 3D integration and packaging.
Dr. Maaike M.V. Taklo is employed as a senior research scientist at SINTEF ICT in Norway at the Department of Instrumentation which she joined in 2010. She is group leader for "Advanced Packaging and Interconnects" within this department. From 1998 until 2010 she was employed at the Department of Microsystems and Nanotechnology within SINTEF ICT where she worked on MEMS processing and was responsible for their wafer level bonding activities. She received her Ph.D. degree in Physical Electronics from the University of Oslo for her thesis entitled "Wafer bonding for MEMS". She is the author or co-author of over 35 papers. In 2008 she received a "Best of Conference" award at the Pan Pacific Symposium for her presentation of "BCB Bonded Wireless Vibration Sensor". She is member of the technical committee of IWLPC and the program committee of 3DIC.
Table of Contents
A. Adhesive and Anodic Bonding
Glass Frit Wafer Bonding Wafer Bonding Using Spin-On Glass as Bonding Material Polymer Adhesive Wafer Bonding Anodic Bonding
B. Direct Wafer Bonding
Direct Wafer Bonding Plasma-Activated Bonding
C. Metal Bonding
Au/Sn Solder Eutectic Au-In Bonding Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers Wafer-Level Solid-Liquid Interdiffusion Bonding
Microelectromechanical Systems Three-Dimensional Integration Temporary Bonding for Enabling Three-Dimensional Integration and Packaging Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems Thin Wafer Support System for above 250?C Processing and Cold De-bonding Temporary Bonding: Electrostatic