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Adhesion in Microelectronics

ISBN: 9781118831335 | 1118831330
Edition: 1st
Format: Hardcover
Publisher: Wiley-Scrivener
Pub. Date: 7/8/2014

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The rationale for compiling this comprehensive book is to provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Our intent in this book is to cover the various aspects of adhesion as they pertain to the field of microelectronics.  Among the topics to be covered include;

 

•              Various theories or mechanisms of adhesion

•              Surface (physical or chemical) characterization of materials as it pertains to adhesion

•              Surface cleaning as it pertains to adhesion

•              Ways to improve adhesion

•              Unraveling of interfacial interactions using an array of pertinent techniques

•              Characterization of interfaces / interphases

•              Polymer-polymer adhesion

  • Metal-polymer adhesion  (metallized polymers)

•              Polymer adhesion to various substrates

•              Adhesion of thin films

•              Adhesion of underfills

•              Adhesion of molding compounds

•              Adhesion of different dielectric materials

•              Delamination and reliability issues in packaged devices

•              Interface mechanics and crack propagation

•              Adhesion measurement of thin films and coatings



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