Amazon no longer offers textbook rentals. We do!

Semiconductor Manufacturing Technology

by: Quirk, Michael; Serda, Julian

Semiconductor Manufacturing Technology

by: Quirk, Michael; Serda, Julian

ISBN 13:
9780130815200
ISBN 10:
0130815209
Edition: 1st
Format: Paperback
Copyright: 11/09/2000
Publisher: Pearson

Rent

Sorry, this item is currently unavailable.

Note: Supplemental materials are not guaranteed with Rental or Used book purchases.

Extend or Purchase Your Rental at Any Time

Need to keep your rental past your due date? At any time before your due date you can extend or purchase your rental through your account.

Summary

This book is written for students in two- and four-year technology programs at community colleges and universities. Chapters are organized around the broad technologies applicable to semiconductor manufacturing.Chapters 1 to 8 present fundamental technical information relevant to semiconductor manufacturing. Chapter 9 presents a process model overview with a general flowchart that links the major areas in wafer fabrication. Chapters 10 to 19 cover each of the major processes. Each process chapter concludes with a summary of quality measures and troubleshooting issues to provide the student with practical challenges encountered during wafer fabrication. Chapter 20 provides an overview of the back-end process for IC assembly and packaging.Academic and industry reviewers have applauded this book as the most comprehensive and up-to-date text currently available in the market.

Introduction to the Semiconductor Industry

Objectives

(1)

Introduction

(1)

Development of an Industry

(2)

Industry Roots

(1)

The Solid State

(1)

Circuit Integration

(2)

Integration Eras

(1)

IC Fabrication

(3)

Wafer Fab

(1)

Stages of IC Fabrication

(2)

Semiconductor Trends

(5)

Increase in Chip Performance

(3)

Increase in Chip Realiability

(1)

Reduction in Chip Price

(2)

The Electronic Era

(2)

The 1950s: Transistor Technology

(1)

The 1960s: Process Technology

(1)

The 1970s: Competition

(1)

The 1980s: Automation

(1)

The 1990s: Volume Production

(1)

Careers in Semiconductor Manufacturing

(3)

Technician

(2)

Job Description

(1)

Summary

(1)

Key Terms

(1)

Review Questions

(1)

Selected Industry Web Sites

(1)

References

(1)

Characteristics of Semiconductor Materials

Objectives

(1)

Introduction

(1)

Atomic Structure

(2)

Electrons

(2)

The Periodic Table

(4)

Ionic Bonds

(2)

Covalent Bonds

(1)

Classifying Materials

(5)

Conductors

(1)

Insulators

(2)

Semiconductors

(1)

Silicon

(6)

Pure Silicon

(1)

Why Silicon?

(1)

Doped Silicon

(5)

pn Junctions

(1)

Alternative Semiconductor Materials

(2)

Gallium Arsenide (GaAs)

(1)

Summary

(1)

Key Terms

(1)

Review Questions

(1)

References

(1)

Device Technologies

Objectives

(1)

Introduction

(1)

Circuit Types

(1)

Analog Circuits

(1)

Digital Circuits

(1)

Passive Component Structures

(1)

IC Resistor Structures

(1)

IC Capacitor Structures

(1)

Active Component Structures

(13)

The pn Junction Diode

(3)

The Bipolar Junction Transistor

(2)

Schottky Diode

(1)

Bipolar IC Technology

(1)

CMOS IC Technology

(6)

Enhancement and Depletion-Mode MOSFETs

(1)

Latchup in CMOS Devices

(1)

Integrated Circuit Products

(3)

Linear IC Product Types

(1)

Digital IC Product Types

(2)

Summary

(1)

Key Terms

(1)

Review Questions

(1)

IC Manufacturers' Web Sites

(1)

References

(2)

Silicon and Wafer Preparation

Objectives

(1)

Introduction

(1)

Semiconductor-Grade Silicon

(1)

Crystal Structure

(3)

Amorphous Materials

(1)

Unit Cells

(1)

Polycrystal and Monocrystal Structures

(1)

Crystal Orientation

(1)

Monocrystal Silicon Growth

(6)

CZ Method

(3)

Float-Zone Method

(1)

Reasons for Larger Ingot Diameters

(2)

Crystal Defects in Silicon

(2)

Point Defects

(1)

Dislocations

(1)

Gross Defects

(1)

Wafer Preparation

(4)

Shaping Operations

(1)

Wafer Slicing

(1)

Wafer Lapping and Edge Contour

(1)

Etching

(1)

Polishing

(1)

Cleaning

(1)

Wafer Evaluation

(1)

Packaging

(1)

Quality Measures

(3)

Physical Dimensions

(1)

Flatness

(1)

Microroughness

(1)

Oxygen Content

(1)

Crystal Defects

(1)

Particles

(1)

Bulk Resisitivity

(1)

Epitaxial Layer

(1)

Summary

(1)

Key Terms

(1)

Review Questions

(1)

Selected Industry Web Sites

(1)

References

(1)

Chemicals in Semiconductor Fabrication

Objectives

(1)

Introduction

(1)

States of Matter

(1)

Properties of Materials

(7)

Chemical Properties for Semiconductor Manufacturing

(6)

Process Chemicals

(10)

Liquids

(4)

Gases

103

(6)

Summary

109

(1)

Key Terms

109

(1)

Review Questions

110

(1)

Chemical Suppliers' Web Sites

110

(1)

References

111

(2)

Contamination Control in Wafer Fabs

Objectives

113

(1)

Introduction

113

(1)

Clean Background

114

(1)

Types of Contamination

114

(6)

Particles

115

(1)

Metallic Impurities

116

(1)

Organic Contamination

117

(1)

Native Oxides

118

(1)

Electrostatic Discharge

119

(1)

Sources and Control of Contamination

120

(15)

Air

120

(1)

Humans

121

(2)

Facility

123

(3)

Water

126

(4)

Process Chemicals

130

(1)

Production Equipment

131

(1)

Workstation Design

131

(4)

Wafer Wet Cleaning

135

(8)

Wet-Cleaning Overview

135

(3)

Wet-Clean Equipment

138

(4)

Alternatives to RCA Clean

142

(1)

Summary

143

(1)

Key Terms

143

(1)

Review Questions

144

(1)

Chemical and Equipment Suppliers' Web Sites

145

(1)

References

146

(3)

Metrology and Defect Inspection

Objectives

149

(1)

Introduction

149

(1)

IC Metrology

150

(2)

Measurement Equipment

151

(1)

Yield

151

(1)

Data Management

152

(1)

Quality Measures

152

(19)

Film Thickness

153

(5)

Film Stress

158

(1)

Refractive Index

158

(1)

Dopant Concentration

159

(2)

Unpatterned Surface Defects

161

(3)

Patterned Surface Defects

164

(1)

Critical Dimension (CD)

165

(2)

Step Coverage

167

(1)

Overlay Registration

167

(1)

Capacitance-Voltage (C-V) Test

168

(3)

Contact Angle

171

(1)

Analytical Equipment

171

(6)

Secondary-Ion Mass Spectrometry (SIMS)

171

(2)

Atomic Force Microscope (AFM)

173

(1)

Auger Electron Spectroscopy (AES)

174

(1)

X-Ray Photoelectron Spectroscopy (XPS)

174

(1)

Transmission Electron Microscope (TEM)

175

(1)

Energy- and Wavelength-Dispersive Spectrometer (EDX and WDX)

176

(1)

Focused Ion Beam (FIB)

176

(1)

Summary

177

(1)

Key Terms

178

(1)

Review Questions

178

(1)

Metrology Equipment Suppliers' Web Sites

179

(1)

References

180

(1)

Gas Control in Process Chambers

Objectives

181

(1)

Introduction

181

(2)

Vacuum

183

(1)

Vacuum Ranges

183

(1)

Mean Free Path

184

(1)

Vacuum Pumps

184

(5)

Roughing Pump

185

(1)

High Vacuum Pump

186

(2)

Vacuum in Integrated Tools

188

(1)

Process Chamber Gas Flow

189

(1)

Mass Flow Controllers

189

(1)

Residual Gas Analyzer (RGA)

190

(2)

RGA Basics

190

(1)

RGA as Real-Time Monitor

191

(1)

Plasma

192

(3)

Glow Discharge

193

(2)

Process Chamber Contamination

195

(1)

Summary

196

(1)

Key Terms

196

(1)

Review Questions

196

(1)

Vacuum Equipment Suppliers' Web Sites

197

(1)

References

197

(2)

IC Fabrication Process Overview

Objectives

199

(1)

Introduction

199

(1)

CMOS Process Flow

199

(6)

Overview of Areas in a Wafer Fab

200

(5)

CMOS Manufacturing Steps

205

(17)

Twin Well Process

205

(2)

Shallow Trench Isolation Process

207

(3)

Poly Gate Structural Process

210

(1)

Lightly Doped Drain (LDD) Implant Process

211

(1)

Sidewall Spacer Formation

212

(1)

Source/Drain (S/D) Implant Processes

213

(1)

Contact Formation

214

(1)

Local Interconnect (LI) Process

214

(2)

Via-1 and Plug-1 Formation

216

(1)

Metal-1 Interconnect Formation

217

(1)

Via-2 and Plug-1 Formation

218

(1)

Metal-2 Interconnect Formation

219

(1)

Metal-3 to Pad Etch and Alloy

220

(1)

Parametric Testing

221

(1)

Summary

222

(1)

Key Terms

223

(1)

Review Questions

223

(1)

References

224

(1)

Oxidation

Objectives

225

(1)

Introduction

225

(1)

Oxide Film

226

(5)

Nature of Oxide Film

226

(1)

Uses of Oxide Film

227

(4)

Thermal Oxidation Growth

231

(8)

Chemical Reaction for Oxidation

231

(1)

Oxidation Growth Model

232

(7)

Furnace Equipment

239

(1)

Horizontal Versus Vertical Furnaces

240

(8)

Vertical Furnace

241

(4)

Fast Ramp Vertical Furnace

245

(1)

Rapid Thermal Processor

246

(2)

Oxidation Process

248

(2)

Pre Oxidation Cleaning

248

(1)

Oxidation Process Recipe

249

(1)

Quality Measurements

250

(2)

Oxidation Troubleshooting

252

(1)

Summary

252

(1)

Key Terms

253

(1)

Review Questions

253

(1)

Furnace and RTP Equipment Suppliers' Web Sites

254

(1)

References

255

(2)

Deposition

Objectives

257

(1)

Introduction

257

(3)

Film Layering Terminology

258

(2)

Film Deposition

260

(5)

Thin-Film Characteristics

260

(3)

Film Growth

263

(1)

Film Deposition Techniques

264

(1)

Chemical Vapor Deposition

265

(4)

CVD Chemical Processes

265

(1)

CVD Reaction

266

(3)

CVD Deposition Systems

269

(13)

CVD Equipment Design

270

(1)

APCVD (Atmospheric Pressure CVD)

271

(2)

LPCVD (Low Pressure CVD)

273

(4)

Plasma-Assisted CVD

277

(5)

Dielectrics and Performance

282

(5)

Dielectric Constant

282

(4)

Device Isolation

286

(1)

Spin-On-Dielectrics

287

(2)

Spin-On-Glass (SOG)

287

(1)

Spin-On-Dielectric (SOD)

288

(1)

Epitaxy

289

(3)

Epitaxy Growth Methods

290

(2)

CVD Quality Measures

292

(1)

CVD Troubleshooting

292

(2)

Summary

294

(1)

Key Terms

295

(1)

Review Questions

295

(1)

Deposition Equipment Suppliers' Web Sites

296

(1)

References

296

(3)

Metallization

Objectives

299

(1)

Introduction

300

(2)

Types of Metals

302

(11)

Aluminum

302

(3)

Aluminum-Copper Alloys

305

(1)

Copper

305

(2)

Barrier Metals

307

(2)

Silicides

309

(3)

Metal Plugs

312

(1)

Metal Deposition Systems

313

(12)

Evaporation

313

(1)

Sputtering

314

(6)

Metal CVD

320

(3)

Copper Electroplate

323

(2)

Metallization Schemes

325

(4)

Traditional Aluminum Structure

325

(1)

Copper Damascene Structure

326

(3)

Metallization Quality Measures

329

(1)

Metallization Troubleshooting

330

(1)

Summary

331

(1)

Key Terms

331

(1)

Review Questions

332

(1)

Metallization Equipment and Materials Suppliers' Web Sites

332

(1)

References

333

(2)

Photolithography: Vapor Prime to Soft Bake

Objectives

335

(1)

Introduction

336

(3)

Photolithography Concepts

336

(3)

Photolithography Processes

339

(3)

Negative Lithography

339

(1)

Positive Lithography

340

(2)

Eight Basic Steps of Photolithography

342

(3)

Step 1: Vapor Prime

343

(1)

Step 2: Spin Coat

343

(1)

Step 3: Soft Bake

344

(1)

Step 4: Alignment and Exposure

344

(1)

Step 5: Post-Exposure Bake (PEB)

344

(1)

Step 6: Develop

344

(1)

Step 7: Hard Bake

344

(1)

Step 8: Develop Inspect

345

(1)

Vapor Prime

345

(3)

Wafer Cleaning

345

(1)

Dehydration Bake

346

(1)

Wafer Priming

346

(2)

Spin Coat

348

(12)

Photoresist

348

(1)

Photoresist Physical Properties

349

(2)

Conventional I-Line Photoresists

351

(3)

Deep UV (DUV) Photoresists

354

(3)

Photoresist Dispensing Methods

357

(3)

Soft Bake

360

(2)

Soft Bake Equipment

360

(1)

Process Characterization

361

(1)

Photoresist Quality Measures

362

(1)

Photoresist Troubleshooting

363

(1)

Summary

364

(1)

Key Terms

364

(1)

Review Questions

364

(1)

Photoresist Materials and Equipment Suppliers' Web Sites

365

(1)

References

366

(1)

Photolithography: Alignment and Exposure

Objectives

367

(1)

Introduction

367

(3)

Importance of Alignment and Exposure

368

(2)

Optical Lithography

370

(18)

Light

370

(2)

Exposure Sources

372

(4)

Optics

376

(9)

Resolution

385

(3)

Photolithography Equipment

388

(18)

Contact Aligner

388

(1)

Proximity Aligner

389

(1)

Scanning Projection Aligner

390

(1)

Step-and-Repeat Aligner (Stepper)

390

(3)

Step-and-Scan System

393

(1)

Reticles

394

(4)

Optical Enhancement Techniques

398

(2)

Alignment

400

(4)

Environmental Conditions

404

(1)

Comparison of Photo Tools

405

(1)

Mix and Match

406

(1)

Alignment and Exposure Quality Measures

407

(1)

Alignment and Exposure Troubleshooting

408

(1)

Summary

409

(1)

Key Terms

410

(1)

Review Questions

410

(1)

Photoresist Materials and Equipment Suppliers' Web Sites

411

(1)

References

412

(1)

Photolithography: Photoresist Development and Advanced Lithography

Objectives

413

(1)

Introduction

413

(1)

Advanced Lithography

414

(1)

Post-Exposure Bake

414

(2)

DUV Post-Exposure Bake (PEB)

415

(1)

Conventional I-Line PEB

416

(1)

Develop

416

(6)

Negative Resist

417

(1)

Positive Resist

418

(1)

Development Methods

419

(2)

Resist Development Parameters

421

(1)

Hard Bake

422

(1)

Develop Inspect

422

(2)

Advanced Lithography

424

(5)

Next-Generation Lithography

424

(4)

Advanced Resist Processing

428

(1)

Develop Quality Measures

429

(2)

Develop Troubleshooting

431

(1)

Summary

432

(1)

Key Terms

433

(1)

Review Questions

433

(1)

Photolithography Materials and Equipment Suppliers' Web Sites

433

(1)

References

434

(1)

Etch

Objectives

435

(1)

Introduction

435

(2)

Etch Processes

436

(1)

Etch Parameters

437

(6)

Etch Rate

437

(1)

Etch Profile

438

(1)

Etch Bias

439

(1)

Selectivity

440

(1)

Uniformity

441

(1)

Residues

441

(1)

Polymer Formation

442

(1)

Plasma-Induced Damage

442

(1)

Particle Contamination

443

(1)

Dry Etch

443

(3)

Etching Action

444

(1)

Potential Distribution

444

(2)

Plasma Etch Reactors

446

(10)

Barrel Plasma Etcher

446

(1)

Parallel Plate (Planar) Reactor

447

(1)

Downstream Etch Systems

448

(1)

Triode Planar Reactor

448

(1)

Ion Beam Milling

448

(2)

Reactive Ion Etch (RIE)

450

(1)

High-Density Plasma Etchers

450

(3)

Etch System Review

453

(2)

Endpoint Detection

455

(1)

Vacuum for Etch Chambers

456

(1)

Dry Etch Applications

456

(8)

Dielectric Dry Etch

457

(2)

Silicon Dry Etch

459

(3)

Metal Dry Etch

462

(2)

Wet Etch

464

(2)

Types of Wet Etch

465

(1)

Historical Perspective

466

(1)

Photoresist Removal

466

(3)

Plasma Ashing

466

(3)

Etch Inspection

469

(1)

Etch Inspection Quality Measures

469

(1)

Dry Etch Troubleshooting

470

(1)

Summary

471

(1)

Key Terms

472

(1)

Review Questions

472

(1)

Etch Equipment Suppliers' Web Sites

473

(1)

References

474

(1)

Ion Implant

Objectives

475

(1)

Introduction

475

(4)

Doped Regions

477

(2)

Diffusion

479

(3)

Diffusion Principles

479

(2)

Diffusion Process

481

(1)

Ion Implanation

482

(6)

Overview

483

(1)

Ion Implant Parameters

484

(4)

Ion Implanters

488

(15)

Ion Source

488

(2)

Extraction and Ion Analyzer

490

(1)

Acceleration Column

491

(3)

Scanning System

494

(4)

Process Chamber

498

(1)

Annealing

499

(2)

Channeling

501

(1)

Particles

502

(1)

Ion Implant Trends in Process Integration

503

(5)

Deep Buried Layers

503

(1)

Retrograde Wells

503

(1)

Punchthrough Stoppers

504

(1)

Threshold Voltage Adjustment

504

(1)

Lightly Doped Drain

505

(1)

Source/Drain Implants

505

(1)

Polysilicon Gate

506

(1)

Trench Capacitor

506

(1)

Ultrashallow Junctions

506

(1)

Silicon-On-Insulator (SOI)

507

(1)

Ion Implant Quality Measures

508

(1)

Ion Implant Troubleshooting

509

(1)

Summary

510

(1)

Key Terms

511

(1)

Review Questions

512

(1)

Ion Implanter Equipment Suppliers' Web Sites

513

(1)

References

513

(2)

Chemical Mechanical Planarization

Objectives

515

(1)

Introduction

515

(3)

Traditional Planarization

518

(2)

Etchback

518

(1)

Glass Reflow

519

(1)

Spin-On Films

520

(1)

Chemical Mechanical Planarization

520

(15)

CMP Planarity

521

(1)

Advantages of CMP

522

(1)

CMP Mechanisms

523

(3)

CMP Slurry and Pad

526

(3)

CMP Equipment

529

(3)

CMP Clean

532

(2)

CMP Equipment Manufacturers

534

(1)

CMP Applications

535

(3)

STI Oxide Polish

535

(1)

LI Oxide Polish

535

(1)

Li Tungsten Polish

536

(1)

ILD Oxide Polish

536

(1)

Tungsten Plug Polish

536

(1)

Dual-Damascene Copper Polish

537

(1)

CMP Quality Measures

538

(2)

CMP Troubleshooting

540

(1)

Summary

541

(1)

Key Terms

541

(1)

Review Questions

542

(1)

CMP Equipment Suppliers' Web Sites

542

(1)

References

543

(2)

Wafer Test

Objectives

545

(1)

Introduction

545

(2)

IC Electrical Tests

546

(1)

Wafer Test

547

(18)

In-Line Parametric Test

547

(8)

Wafer Sort

555

(5)

Yield

560

(3)

Wafer Sort Yield Models

563

(2)

Test Quality Measures

565

(2)

Test Troubleshooting

567

(1)

Summary

567

(1)

Key Terms

568

(1)

Review Questions

568

(1)

Test and Prober Equipment Suppliers' Web Sites

569

(1)

References

569

(2)

Assembly and Packaging

Objectives

571

(1)

Introduction

571

(3)

Packaging Levels

573

(1)

Traditional Assembly

574

(6)

Backgrind

574

(1)

Die Separation

575

(1)

Die Attach

575

(2)

Wirebonding

577

(3)

Traditional Packaging

580

(6)

Plastic Packaging

581

(3)

Ceramic Packaging

584

(2)

Final Test

586

(1)

Advanced Assembly and Packaging

586

(10)

Flip Chip

587

(2)

Ball Grid Array (BGA)

589

(1)

Chip on Board (COB)

590

(1)

Tape Automated Bonding (TAB)

591

(1)

Multichip Module (MCM)

591

(1)

Chip Scale Packaging (CSP)

592

(1)

Wafer-Level Packaging

592

(4)

Assembly and Packaging Quality Measures

596

(1)

IC Packaging Troubleshooting

597

(1)

Summary

597

(1)

Key Terms

598

(1)

Review Questions

598

(1)

Assembly and Packaging Suppliers' Web Sites

599

(1)

References

600

(1)

APPENDICES

Appendix A Chemicals and Safety

601

(9)

Appendix B Contamination Controls in Cleanrooms

610

(4)

Appendix C Units

614

(3)

Appendix D Color as a Function of Oxide Thickness

617

(1)

Appendix E Overview of Photoresist Chemistry

618

(4)

Appendix F Etch Chemistry

622

(2)

Glossary

624

(24)

Index

648

Amazon no longer offers textbook rentals. We do!

Semiconductor Manufacturing Technology

Semiconductor Manufacturing Technology

9780130815200

0130815209

Summary

Table of Contents

Supplemental Materials

Excerpts

Write a Review