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Semiconductor Manufacturing Handbook

by: Geng, Hwaiyu

Semiconductor Manufacturing Handbook

by: Geng, Hwaiyu

ISBN 13:
9780071445597
ISBN 10:
0071445595
Edition: 1st
Format: Hardcover
Copyright: 05/18/2005
Publisher: McGraw-Hill Education
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Summary

This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.

Board of Reviewers

Contributors

xvii

Preface

xix

Acknowledgments

xxi

Part 1 Semiconductor Fundamentals and Basic Materials

How Semiconductor Chips Are Made

Hwaiyu Geng

Lin Zhou

Introduction

(1)

What Is a Chip

(1)

Moore's Law

(1)

How Chips Are Designed

(1)

Where Chips Are Made

(1)

How Chips Are Made

References

IC Design

(1)

Ilsun Park

Introduction

(1)

Types of ICs

(1)

The P/N Junction

(1)

The Transistor

(3)

Designing an IC

(1)

Future Trends and Issues in IC Design

References

Silicon Substrates for Semiconductor Manufacturing

(1)

K. V. Ravi

Introduction

(1)

Key Attributes of Silicon as a Substrate Material

(2)

The Basics of Silicon Wafer Manufacture

(1)

Silicon as a Substrate Material

(10)

Key Issues and Challenges in the Manufacture of Silicon Substrates

(3)

Conclusions

References

Copper, Low-k Dielectrics, and Their Reliability

(1)

Hazara S. Rathore

Kaushik Chanda

Introduction

(1)

Copper Interconnect Technology

(4)

Low-k Dielectrics Technology

(2)

Copper/Low-k Dielectrics Reliability

References

Fundamentals-Silicide Formation on Si

(1)

L. P. Ren

King N. Tu

Introduction

(2)

What Are the Fundamentals of Silicidation on Si?

(4)

Future Trends and Nanosilicide Formation

(2)

Conclusions

References

Plasma Process Control

(1)

David J. Coumou

Introduction

(1)

Fundamentals of Plasma Generation and Process Control

(6)

Process Control and Metrology

(8)

Properties of Dry Etch Process

(1)

Future Trends and Conclusions

References

Vacuum Technology

(1)

Peter Biltoft

Vacuum Technology Overview

(1)

Methods for Measuring Subatmospheric Pressure

(3)

Methods for Creating a Vacuum

(3)

Vacuum System Components

(1)

Leak Detection

(1)

Design of a Vacuum System

(4)

Future Trends and Conclusions

Further Reading

(1)

Information Resources

Photomask

(2)

Charles Howard

Introduction

(1)

Photomask Fundamentals

(3)

Photomask Equipment

(1)

Operations, Economics, Safety, and Maintenance Considerations

(1)

Future Trends and Conclusions

Bibliography

Part 2 Wafer Processing

Microlithography

Chris A. Mack

The Lithographic Process

(6)

Image Formation in Optical Lithography

(8)

Photoresist Chemistry

(4)

Linewidth Control

(4)

The Limits of Optical Microlithography

Further Reading

Ion Implantation and Rapid Thermal Processing

(1)

Michael Graf

Overview

(2)

Components of an Ion Implantation System

(6)

Endstation Architectures

(1)

Key Process and Manufacturing Issues

(5)

Resources in Ion Implantation

References

Wet Etching

(1)

Peng Zhang

Introduction

(1)

HF-Based Etching Chemistry

(3)

Metal Etching

(1)

Wet Etching for Compound Semiconductor

(2)

Equipment for Wet Etch

(1)

Environmental, Health, and Safety Issues

References

Plasma Etching

(1)

Shouliang Lai

Introduction

(3)

Plasma Etching in Silicon-Based IC Devices

(4)

Plasma Etching in Si-Based MEMS Devices

(7)

Plasma Etching in III-V Compound Semiconductors

(5)

Endpoint Detection in Plasma Etching

(2)

Conclusions

Acknowledgments

(1)

References

Physical Vapor Deposition

(1)

Florian Solzbacher

Introduction to Physical Vapor Deposition PVD

(1)

Fundamentals of PVD Processes

(1)

Vacuum Evaporation

(4)

Evaporator Equipment

(1)

Layers Deposited Using Evaporation and Their Properties

(1)

Sputtering

(4)

Sputter Equipment

(7)

Layers Deposited Using Sputtering

(1)

Atomic Layer Deposition---New Perspectives for Thin Film Deposition Techniques

(1)

Summary and Outlook

References

Chemical Vapor Deposition

(1)

Edward J. Mclnemey

Introduction

(2)

Theory

(8)

Components of a CVD System

(2)

Precoating and Cleaning

(1)

Troubleshooting

(2)

Future Trends

References

Epitaxy

(1)

Jamal Ramdani

Giovanni Vaccari

Introduction

(5)

Silicon Epitaxy for Advanced CMOS Technology

(7)

Manufacturing

(2)

Safety and Environmental Health

(1)

Future Epitaxy Trends

(1)

Conclusions

References

(1)

Further Reading

ECD Fundamentals

(1)

Tom Ritzdorf

John Klocke

Introduction

(1)

Fundamental ECD Technology (How Plating Works)

(3)

Benefits of Copper Damascene ECD Processing

(1)

Integration of Copper ECD into the Production Line

(1)

Additional Considerations for Copper ECD Processing

(2)

Future Trends

(1)

Summary

References

Chemical Mechanical Planarization

(1)

Timothy S. Dyer

Introduction to CMP

(2)

Most Common CMP Processes

(2)

Review of CMP Process Control

(3)

Post-CMP Wafer Cleaning

(1)

Common CMP Platforms and Tools

(3)

CMP Process Waste Management

(1)

Future Trends and Conclusions

Further Reading

(1)

Information Resources

Wet Cleaning

(2)

Andrew Machamer

Overview and Background of Wet Cleaning

(6)

Typical Semiconductor Manufacturing Wet Cleaning Processes

(4)

Wet Cleaning Equipment Technology

(1)

Future Trends and Conclusions

References

Part 3 Final Manufacturing

Inspection, Measurement, and Test

Donald W. Blair

Introduction---Overview on Testing Equipment

(5)

Fundamentals of Test Equipment and Manufacturing Automation Systems

(23)

How to Prepare, Plan, Specify, Select Vendor, and Purchase Test Equipment

(7)

What Are Operation, Safety, Calibration, and Maintenance Considerations?

(4)

Future Trends and Conclusions

Acknowledgment to Authors

(1)

Further Reading

(1)

Information Resources

Grinding, Stress Relief, and Dicing

(1)

Kazuhisa Arai

Yoshikazu Kobayashi

Hideaki Otani

Introduction

(1)

Grinding Technology Overview

(1)

A General Look at Grinders

(6)

Dicing Overview

(4)

Dicing Saw Overview

(3)

Fabrication Equipment Requirements

(1)

Thinning

(5)

All in One System

(1)

Future Technology Trends

Further Reading

Packaging

(2)

Dietrich Tonnies

Michael Topper

Introduction

(8)

Packaging Evolution

(8)

Wafer Bumping and Redistribution Technology

(28)

Case Studies

(6)

Optoelectronics and MEMS Packaging

References

(2)

Bibliography

Part 4 Nanotechnology, MEMS, and FPD

Nanotechnology and Nanomanufacturing

Zhong L. Wang

What Is Nanotechnology?

(1)

Nanotechnology and Biotechnology

(1)

Nanomanufacturing: Approaches and Challenges

(7)

Nanomanufacturing---Going Beyond the Engineering Process

Acknowledgment

(1)

References

Fundamentals of Microelectromechanical Systems

(1)

Michael A. Huff

Introduction

(2)

Technology Fundamentals of MEMS

(5)

How Are MEMS Made?

(16)

What Are the Applications of MEMS?

(2)

Future Trends

(1)

Conclusions

References

(2)

Other Information

Flat-Panel Display Technology and Manufacturing

(2)

David N. Liu

Introduction

(1)

Definitions

(2)

What Are the Fundamentals and Principles of FPD?

(7)

What Is the Manufacturing Process?

(2)

Future Trends and Conclusions

Further Reading

Part 5 Gases and Chemicals

Specialty Gas and CDA Systems

Wayne D. Curcie

Introduction

(1)

Semiconductor Manufacturing Process Requirements

(2)

Code Requirements and Other General Design Considerations

(3)

Specialty Gas Dispense and Distribution

(8)

Implementation

(5)

Future Trends on Specialty Gas Systems

(4)

Clean Dry Air

(2)

Conclusion

Acknowledgments

(1)

References

(1)

Further Reading

Waste Gas Abatement Systems

(1)

Joseph D. Sweeney

Introduction

(2)

Fundamentals and Principles

(8)

Major Components

(4)

Important Considerations

(2)

Future Trends

References

PFC Abatement

(1)

James C. Cox

Perfluorocarbon Compounds

(3)

PFC Emission Reduction Strategies

(2)

PFC Abatement Theory

(3)

Catalytic Abatement

References

Chemical and Slurry Handling Systems

(1)

Kristin Cavicchi

Dan Barsness

Introduction

(1)

Elements of Chemical and Slurry Handling Systems and Important Terms

(1)

Equipment

(4)

High-Purity Chemical Blending

(5)

System Purity

(5)

CMP Slurry Systems

(3)

Conclusions

References

Fluid Handling Components for High Purity Liquid Chemicals and Slurries

(1)

Charles K. Gould

Introduction

(1)

Materials of Construction for Fluid Handling Components

(2)

Metal Impurities, Total Oxidizable Carbon, and Particle Contamination

(1)

Industry Test Standards and Protocols

(1)

Fluid Handling Components

(6)

Fluid Measurement Devices

(8)

Process Control Applications

(2)

Conclusions

Further Reading

Fundamentals of Ultrapure Water

(2)

David J. Albrecht

Introduction

(1)

Unit Operations for UDI Systems

(1)

Initial Feedwater

(4)

Pretreatment

(3)

Primary Treatment

(5)

Final Treatment, Polishing, and Distribution

(2)

Future Trends

References

Part 6 Fab Yield, Operations, and Facilities

Yield Management

Bo Li

Wayne Carriker

Introduction

(1)

What Is Yield Management and Why It Is Important?

(3)

What Are the Elements that Yield Management Consists of and How Are Yield Management Systems Implemented?

(9)

What Are the Considerations in Optimizing Yield Management Systems?

(2)

Trends and Conclusions

Further Reading

Automated Material Handling System

(1)

Clint Haris

Introduction

(1)

Principal Components of an AMHS

(4)

The Design of an AMHS

(3)

Operational Considerations

(2)

Future Trends

CD Metrology and CD-SEM

(1)

Ram Peltinov

Mina Menaker

Introduction

(1)

Fundamental CD Metrology Concepts

(1)

Basic Concepts of CD-SEM System

(3)

CD-SEM Specification and Selection Process

(4)

Future Trends and Conclusions

References

Six Sigma

(1)

Bruno Scibilia

Yoan Dupret

What Is Six Sigma?

(1)

Fundamental Strengths of Six Sigma

(2)

The Major DMAIC Phases

(4)

Design for Six Sigma (DFSS)

(2)

Some Applications

(6)

Future Trends and Conclusions

Bibliography

Advanced Process Control

(1)

Robert H. McCafferty

Technology Overview

(1)

Fundamentals of Advanced Process Control

(8)

Applications

(8)

Application Considerations

(3)

Future Trends and Conclusions

References

Environmental, Health, and Safety Considerations in Semiconductor Fabrication Facilities

(1)

Brett J. Davis

Steven R. Trammell

Introduction

(1)

EHS Hazards from Semiconductor Manufacturing

(4)

EHS Regulations Applicable to Semiconductor Manufacturers

(10)

Beyond Regulatory Compliance

(2)

The Future of Semiconductor EHS

Further Reading

(1)

Information Resources

Plan, Design, and Construction of a FAB

(1)

Introduction

(1)

Planning

(9)

Design

(8)

Construction

(7)

Conclusions

Cleanroom Design and Construction

(1)

Richard V. Pavlotsky

Stephen C. Beck

Introduction

(1)

Cleanroom Standards, Classifications, and Certification

(3)

Types of Cleanroom

(3)

Airflow Layouts and Patterns

(2)

Air Changes

(1)

Elements of a Cleanroom

(1)

Environmental Conditional Requirements

(4)

Process Contamination Control

(1)

Vibration and Noise Control

(1)

Magnetic and Electromagnetic Flux

(1)

Electrostatic Charge of Air and Surfaces

(1)

Life Safety

(1)

Computational Fluid Dynamics

(1)

Cleanroom Economics

(3)

Practical Problems and Solutions Samples

Further Reading

(1)

Information Resources

Micro-Vibration and Noise Design

(1)

Michael Gendreau

Hal Amick

Introduction

(1)

Measurement Methodology and Criteria

(7)

Vibration and Noise Sources

(1)

Foundation and Structural Design

(5)

Vibration and Noise Control in the Mechanical/Electrical/Process (MEP) Design

(10)

Acoustic Design

(2)

Tool Hook-Up

(1)

Purposes and Timing of Facility Vibration Surveys

(1)

Maturation of the Vibration and Noise Environment

(1)

Future Trends and Special Cases

Acknowledgments

(1)

References

ESD Controls in Cleanroom Environments

(1)

Larry Levit

Electrostatic Charge in Semiconductor Cleanrooms

(1)

Problems Resulting from Charge in Cleanrooms

(6)

Static Charge Generation

(1)

Insulators Versus Conductors

(2)

Cleanroom Electrostatic Management

(2)

Air Ionization for Static Charge Control

(3)

Electrostatic Measurement

(3)

Air Ionizer Applications

(2)

Conclusions

References

Airborne Molecular Contamination

(1)

Chris Muller

Introduction to Chemical Contamination and Definition of AMC

(1)

Classification of AMC

(2)

AMC Control Considerations

(2)

Implementing AMC Control

(1)

Gas-Phase Air Filtration Principles

(2)

Dry-Scrubbing Air Filtration Media

(3)

Chemical Filtration Equipment Designs

(2)

AMC Monitoring

(3)

AMC Control Application Areas

(2)

AMC Control Specifications and Standards

(1)

Specifying an AMC Control System

(3)

Final Considerations

(1)

Summary

References

(1)

Information Resources

Particle Monitoring in Semiconductor Manufacturing

(1)

Steven Kochevar

Jerry Gromala

Introduction

(4)

Particle Counter Theory of Operation

(2)

Specifying a Particle Counter

(1)

Special Considerations for Aerosol Applications

(3)

Special Considerations for Liquid Applications

(5)

Contamination Control Hierarchy

(4)

Airborne Molecular Contamination

(1)

Conclusions

Note

(1)

References

Wastewater Neutralization Systems

(1)

Richard E. Pinkowski

Introduction

(1)

Water and pH

(4)

Application Evaluation

(2)

Architecture of Standard pH Adjustment Systems

(8)

System Optimization

(8)

The Control System

(2)

Chemicals Used for pH Adjustment

(4)

The Application of pH Adjustment in Chemical Mechanical Polishing, Metal Reduction, and Fluoride Reduction

Bibliography

Appendix

(1)

Index

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Semiconductor Manufacturing Handbook

Semiconductor Manufacturing Handbook

9780071445597

0071445595

Summary

Author Biography

Table of Contents

Supplemental Materials

Write a Review

Amazon no longer offers textbook rentals. We do!

Semiconductor Manufacturing Handbook

Semiconductor Manufacturing Handbook

9780071445597

0071445595

Summary

Author Biography

Table of Contents

Supplemental Materials

Write a Review

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