The reliability of components is a prime concern to electronics manufacturers and the failure of microelectronic packaging is a major source of component faults. Failure of electronic packaging: effects of temperature, moisture, mechanical and electrical driving forces provides a thorough review to this important field of research. This practical guide discusses theoretical aspects, experimental results, modeling techniques and results. The authors have used their extensive experience to produce detailed chapters covering temperature, moisture, mechanical shock and electrical induced failure in addition to adhesive interconnects and viscoelasticity. Useful program files and macros are included.