Woong Hwan Ryu is currently a Signal/Power Integrity Engineering Manager at Intel Corporation. He has been responsible for pre-silicon signal integrity and power integrity analysis for high speed interfaces. He received his Ph.D. degree in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST). Dr. Ryu holds an IEEE Senior Member status; he serves as a reviewer for several IEEE journals; and he serves as a technical program committee member and organizing committee member for DesignCon. He was a recipient of the International Engineering Consortium’s paper awards for DesignCon 2006 and DesignCon 2008. Dr. Ryu has authored and co-authored more than 80 technical publications in premier journals and international conferences, and holds three issued patents and has one patent pending.

Myoung Joon Choi is a technical lead in the Signal/Power Integrity Engineering team at Intel Corporation. He works on developing methodologies for high-speed interface simulation and analysis. His focus areas include high-speed system SI-PI co-simulation, on-chip signal and power integrity, and computational analysis of entire high-speed systems. Dr. Choi has received a Ph.D. and an M.S. from University of Illinois at Urbana-Champaign, Urbana, IL, USA, and a BS from Korea University, Seoul, Korea. He has authored and co-authored many technical publications in journals and conferences.

Chapter 1   Introduction     1

1.1 Digital Electronic System     1

1.2 I/O Signaling Standards     2

     1.2.1 Single-Ended and Differential Signaling     3

1.3 Power and Signal Distribution Network     5

1.4 Signal and Power Integrity     6

1.5 Power Noise to Signal Coupling     8

     1.5.1 SSO     9

     1.5.2 Chip-Level SSO Coupling     9

     1.5.3 Interconnect Level SSO Coupling     10

1.6 Concurrent Design Methodology     12

References     13

Chapter 2   I/O Interfaces     15

2.1 Single-Ended Drivers and Receivers     15

     2.1.1 Open Drain Drivers     16

     2.1.2 Push-Pull Driver and Receiver     17

     2.1.3 Termination Schemes for a Single-Ended System     18

     2.1.4 Current Profiles in a Push-Pull Driver     18

          Push-Pull Driver with CTT     19

          Push-Pull Driver with Power Termination     22

     2.1.5 Noise for Push-Pull Driver     25

2.2 Differential Drivers and Receivers     26

     2.2.1 Termination Schemes for Differential System     28

     2.2.2 Current Profiles in Half Differential Driver     30

     2.2.3 Noise for Half Differential Driver     32

2.3 Prior Stages of I/O Interface     34

References     35

Chapter 3   Electromagnetic Effects     37

3.1 Electromagnetic Effects on Signal/Power Integrity     37

3.2 Electromagnetic Theory     39

     3.2.1 Maxwell’s Equations     40

3.3 Transmission Line Theory     46

3.4 Interconnection Network Parameters: Z,Y,S and ABCD     55

     3.4.1 Impedance Matrix [Z]     56

     3.4.2 Admittance Matrix [Y]     57

     3.4.3 The Scattering Matrix [S]     57

     3.4.4 The Scattering Matrix [S]     with Arbitrary Loads 59

     3.4.5 Relation Between Scattering Matrix [S] and Y/Z/ABCD Matrix    61

3.5 LTI System     64

     3.5.1 Reciprocal Network     64

     3.5.2 Parameter Conversion Singularity     64

     3.5.3 Stability     65

     3.5.4 Passivity     65

     3.5.5 Causality    67

References     67

Chapter 4   System Interconnects     69

4.1 PCB Technology     69

4.2 Package Types     70

4.3 Power Distribution Network    73

     4.3.1 PCB PDN     73

          Power Supply    74

          DC/DC Converter     75

          PCB Capacitors    76

          PCB Power/Ground Planes    81

          Impact of Vias     87

          Stitching Domains Together     90

     4.3.2 Package Power Distribution Network     92

   4.3.3 On-Chip Power Network     93

          Intentional Capacitors    94

          Unintentional Capacitors     96

4.4 Signal Distribution Network     97

     4.4.1 PCB/ Package Physical Signal Routing    97

          Microstrip Line    97

          Stripline     100

          Co-Planar Waveguide     101

          Coupled Lines     102

     4.4.2 Package Signal Distribution Network     107

     4.4.3 PCB/Package Material Properties     108

          Electrical Properties of Metal     108

          Electrical Properties of Dielectrics     110

          Frequency-Dependent Parameters of Microstrip Line    111

     4.4.4 On-Chip Signal Network     112

4.5 Interaction Between Interconnect Systems     115

     4.5.1 Reference, Ground, and Return Paths     116

     4.5.2 Referencing: Single-Ended and Differential Signaling     116

     4.5.3 Power to Signal Coupling     118

4.6 Modeling Tools for the PDN and Signal Networks     119

References     122

Chapter 5   Frequency Domain Analysis     127

5.1 Signal Spectrum     128

     5.1.1 Fourier Transform Interpretation     132

     5.1.2 Important Properties of the Fourier Transform     134

          Interpreting and Using Frequency Domain Representations of Waveforms     134

          Key Properties of Fourier Transforms (of Interest in SI)     134

          Fourier Transform Examples and Interpretation     135

          Trapezoidal Pulse Fourier Transform Tool     138

     5.1.3 FFT of Power Noise     141

     5.1.4 Convolution and Filtering     142

5.2 Signal and Power Integrity Applications     143

     5.2.1 S-Parameters with Global and Local Ground     145

5.3 Power Distribution Network Design in Frequency Domain     147

     5.3.1 Impedance Response Z11     148

     5.3.2 Impedance Targets for I/O Interface     150

          Single-Ended Driver     151

          Differential Driver     152

          Prior Stages     152

     5.3.3 PDN Design Example     153

          Package and PCB PDN     154

          PDN Co-Design: PCB, Package and Chip    155

     5.3.4 On-Chip Power Delivery: Modeling and Characterization     158

          Test Vehicle for On-Chip PDN     159

          2D TLM Empirical On-Chip PD Modeling Method    161

          On-Chip Capacitor Model Extraction     162

          Modeling and Correlation for On-Chip PDN of the I/O Interface    163

          EM Modeling of On-Chip PDN     165

     5.3.5 Insertion Loss and Voltage Transfer Function     166

     5.3.6 SSO in Frequency Domain     168

     5.3.7 Power-to-Signal Coupling     170

5.4 Signal Network Design in Frequency Domain     171

     5.4.1 Frequency Domain Optimization     172

     5.4.2 Simulation and Correlation of Signal Network     174

     5.4.3 Case Study: Crosstalk Amplification by Resonance     175

          Model Correlation     177

          Self-Impedance and Insertion Loss for the Entire Channel     180

          Voltage Transfer Function for the Victim Bit     181

          Far-End Crosstalk     182

          Self-Impedance and Transfer Impedance with Different Enablers    183

     5.4.4 Differential Signaling in Frequency Domain     184

References     190

Chapter 6   Time Domain Analysis     193

6.1 Time Domain Modeling and Simulation     193

     6.1.1 Transient Simulations     195

     6.1.2 Buffer Modeling     196

          IBIS and VCR Models     196

6.2 Simulation for Optimization     198

     6.2.1 Power Delivery Time Domain Specification     198

     6.2.2 Controllable Design Variables for Optimization     200

          Geometry and Material     201

          Passive Components on PCB and Package     203

          On-Chip Design Variables     203

6.3 PDN Noise Simulations     204

     6.3.1 VR Tolerance and IR Drop     204

     6.3.2 AC Noise Analysis     207

          Supply Droop and Resonance     207

     6.3.3 Internal Circuits     209

     6.3.4 Final Stage Circuits     210

     6.3.5 Single-Ended Systems     212

          Correlation with Measurements     214

          Noise Measurements at the Receiver     215

     6.3.6 Differential Systems     217

     6.3.7 Logic Stage     220

6.4 Jitter Impact for Time Domain Analysis     221

     6.4.1 Jitter Impact Due to PDN Noise     222

     6.4.2 Jitter Due to the SSO     223

          Single-Ended System     223

          Differential System     228

References     231

Chapter 7   Signal/Power Integrity Interactions     233

7.1 Background     234

7.2 Root Cause Analysis     236

7.3 SSO Coupling Mechanism     238

7.4 Case Study I: DDR2 800 Control Signal     241

     7.4.1 Noise Source     243

     7.4.2 Coupling Mechanism     244

     7.4.3 Resonant Structure on Control Networks     245

     7.4.4 Proposed Solutions     247

7.5 Case Study II: DDR2 667 Vref Bus     248

     7.5.1 Noise Source     249

     7.5.2 Coupling Mechanism     249

     7.5.3 Resonance Structure     250

     7.5.4 Proposed Solutions     252

7.6 Referencing/Stitching/Decoupling Effects--Single-Ended Interface     258

7.7 Stitching Effects--Differential Interface     263

     7.7.1 VNA Measurement Results     271

     7.7.2 Modeling and Measurement Correlations     273

     7.7.3 System-Level Impact Evaluation     274

7.8 EMI Trade-Off     276

     7.8.1 Power Islands Radiation     276

References     282

Chapter 8   Signal/Power Integrity Co-Analysis     285

8.1 Identifying Controllable Parameters     286

8.2 SI-PI Modeling and Simulation     288

     8.2.1 Modeling SI-PI Compatible Buffers     288

     8.2.2 Modeling On-Chip Passive Components     290

     8.2.3 Modeling Off-Chip Passive Components     291

     8.2.4 Model Check and Integration     291

     8.2.5 Construction of SI-PI Co-Simulation     292

     8.2.6 PDN Resonance Excitation of Driver Bit Pattern     292

     8.2.7 Worst-Case Eye     294

     8.2.8 Running SI-PI Co-Simulation     296

          ISI and Minimal ISI     297

          ISI and SSO     298

          ISI and Crosstalk     299

          ISI, SSO, and Crosstalk     299

8.3 SI-PI Co-Analysis     301

     8.3.1 Time Domain Analysis     301

          Optimization Using Sweep Parameters and Noise Decomposition     302

          Simple Comparison of Eye     305

     8.3.2 Eye Diagram Analysis     308

     8.3.3 Linear Interaction Indicator     309

          Single-Ended Signaling SI-PI Performance and Linearity     315

          Differential Signaling SI-PI Performance and Linearity     317

          SI-PI Linear Interaction Indicator     319

8.4 SI-PI Co-Simulation and Co-Analysis Flow: Summary     321

References     322

Chapter 9   Measurement Techniques     325

9.1 Frequency Domain Characterization     325

     9.1.1 Vector Network Analyzer (VNA)     326

     9.1.2 Smith Chart     327

     9.1.3 Low-Impedance VNA Measurement for Power Delivery Network     329

     9.1.4 On-Chip Characterization     335

          On-Chip Interconnect 2D Modeling and Correlation     338

          On-Chip Interconnection Line Performance Versus Different Structures     345

          On-Chip PDN Characterization     349

     9.1.5 Pad Capacitance Characterization     350

          Lower- and Upper-Frequency Limit     350

          De-Embedding Method     351

     9.1.6 Power Delivery-to-Signal Coupling Measurement     353

9.2 Equivalent Circuit Model Extraction     355

     9.2.1 Need for an Equivalent Circuit Model     355

          Validation Purpose     355

          Simulation Purpose     356

     9.2.2 Extraction Methodology     357

Numerical Error     358

     9.2.3 Extraction Examples     358

          Receiver Model for SI     358

          PDN Model     360

          Topology Identification     360

     9.2.4 Extension to Multiport Measurement     361

9.3 Time Domain Characterization     361

     9.3.1 Time Domain Reflectometry (TDR)     361

          Development of 9ps TDR Measurement Setup     363

          Package Validation Using TDR     365

          Differential TDR and TDT     371

     9.3.2 PDN Noise Measurement     372

     9.3.3 SSO Coupling Measurement in Time Domain     376

     9.3.4 Jitter Measurement     379

References     380

Index     383

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