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Microchip Fabrication, 5th Ed.

by: Van Zant, Peter

Microchip Fabrication, 5th Ed.

by: Van Zant, Peter

ISBN 13:
9780071432412
ISBN 10:
0071432418
Edition: 5th
Format: Hardcover
Copyright: 06/09/2004
Publisher: McGraw-Hill Education
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Summary

With a new chapter on nanotechnology and new sections on 300mm wafer processing, "Microchip Fabrication" has been updated to reflect the latest processing techniques.

Preface

xiii

Chapter 1. The Semiconductor Industry

(24)

Overview

(1)

Objectives

(1)

Birth of an Industry

(2)

The Solid-State Era

(1)

Integrated Circuits (ICs)

(1)

Process and Product Trends

(8)

Industry Organization

(1)

Stages of Manufacturing

(3)

The Junction Transistor

(2)

Five Decades of Industry Development

(2)

The Nano Era

(2)

Review Questions

(1)

References

(1)

Chapter 2. Properties of Semiconductor Materials and Chemicals

(26)

Overview

(1)

Objectives

(1)

Atomic Structure

(1)

The Periodic Table of the Elements

(2)

Electrical Conduction

(1)

Dielectrics and Capacitors

(1)

Intrinsic Semiconductors

(1)

Doped Semiconductors

(1)

Electron and Hole Conduction

(4)

Semiconductor Production Materials

(1)

Semiconducting Compounds

(2)

Silicon Germanium

(1)

Engineered Substrates

(1)

Ferroelectric Materials

(1)

Diamond Semiconductors

(1)

Process Chemicals

(2)

States of Matter

(1)

Properties of Matter

(2)

Pressure and Vacuum

(1)

Acids, Alkalis, and Solvents

(2)

Chemical Purity and Cleanliness

(1)

Review Questions

(1)

References

(2)

Chapter 3. Crystal Growth and Silicon Wafer Preparation

(20)

Overview

(1)

Objectives

(1)

Introduction

(1)

Semiconductor Silicon Preparation

(1)

Crystalline Materials

(2)

Crystal Orientation

(1)

Crystal Growth

(3)

Crystal and Wafer Quality

(3)

Wafer Preparation

(2)

Wafer Slicing

(1)

Wafer Marking

(1)

Rough Polish

(2)

Chemical Mechanical Polishing (CMP)

(1)

Backside Processing

(1)

Double-Sided Polishing

(1)

Edge Grinding and Polishing

(1)

Wafer Evaluation

(1)

Oxidation

(1)

Packaging

(1)

Engineered Wafers (Substrates)

(1)

Review Questions

(1)

References

(1)

Chapter 4. Overview of Wafer Fabrication

(20)

Overview

(1)

Objectives

(1)

Goal of Wafer Fabrication

(1)

Wafer Terminology

(1)

Basic Wafer-Fabrication Operations

(10)

Example Fabrication Process

(4)

Chip Terminology

(1)

Wafer Sort

(2)

Packaging

(1)

Summary

(1)

Review Questions

(1)

References

(1)

Chapter 5. Contamination Control

(48)

Overview

(1)

Objectives

(1)

Introduction

(4)

Contamination Sources

(10)

Cleanroom Construction

106

(13)

Cleanroom Materials and Supplies

119

(1)

Cleanroom Maintenance

119

(1)

Wafer Surface Cleaning

120

(15)

Review Questions

135

(1)

References

136

(3)

Chapter 6. Productivity and Process Yields

139

(20)

Overview

139

(1)

Objectives

139

(1)

Yield Measurement Points

140

(1)

Accumulative Wafer-Fabrication Yield

140

(2)

Wafer-Fabrication Yield Limiters

142

(13)

Assembly and Final Test Yields

155

(1)

Overall Process Yields

155

(2)

Review Questions

157

(1)

References

157

(2)

Chapter 7. Oxidation

159

(38)

Overview

159

(1)

Objectives

159

(1)

Silicon Dioxide Layer Uses

160

(3)

Thermal Oxidation Mechanisms

163

(28)

Oxidation Processes

191

(2)

Postoxidation Evaluation

193

(2)

Review Questions

195

(1)

References

195

(2)

Chapter 8. The Ten-Step Patterning Process-Surface Preparation to Exposure

197

(48)

Overview

197

(1)

Objectives

197

(1)

Introduction

198

(1)

Overview of the Photomasking Process

199

(2)

Ten-Step Process

201

(1)

Basic Photoresist Chemistry

202

(5)

Photoresist Performance Factors

207

(7)

Physical Properties of Photoresists

214

(3)

Photomasking Processes

217

(1)

Surface Preparation

218

(3)

Photoresist Application (Spinning)

221

(6)

Soft Bake

227

(4)

Alignment and Exposure

231

(12)

Advanced Lithography

243

(1)

Review Questions

243

(1)

References

244

(1)

Chapter 9. The Ten-Step Patterning Process-Developing to Final Inspection

245

(38)

Overview

245

(1)

Objectives

245

(7)

Hard Bake

252

(2)

Integrated Image Processing

254

(4)

Etch

258

(1)

Wet Etching

259

(5)

Dry Etch

264

(9)

Resist Stripping

273

(4)

Final Inspection

277

(1)

Mask Making

278

(2)

Summary

280

(1)

Review Questions

280

(1)

References

281

(2)

Chapter 10. Advanced Photolithography Processes

283

(42)

Overview

283

(1)

Objectives

283

(1)

Issues of VLSI/VLSI Patterning

284

(8)

Other Exposure Issues

292

(8)

Surface Problems

300

(1)

Antireflective Coatings

301

(3)

Photoresist Process Advances

304

(15)

Improving Etch Definition

319

(1)

Self-Aligned Structures

320

(1)

Etch Profile Control

321

(1)

Review Questions

321

(1)

References

322

(3)

Chapter 11. Doping

325

(40)

Overview

325

(1)

Objectives

325

(1)

Introduction

325

(1)

Formation of a Doped Region by Diffusion

326

(2)

Formation of a Doped Region and Junction by Diffusion

328

(5)

Diffusion Process Steps

333

(1)

Deposition

333

(8)

Drive-in Oxidation

341

(4)

Introduction to Ion Implantation

345

(1)

Concept of Ion Implantation

346

(1)

Ion Implantation System

346

(9)

Dopant Concentration in Implanted Regions

355

(4)

Evaluation of Implanted Layers

359

(2)

Uses of Ion Implantation

361

(1)

The Future of Doping

362

(1)

Review Questions

363

(1)

References

363

(2)

Chapter 12. Layer Deposition

365

(36)

Overview

365

(1)

Objectives

365

(1)

Introduction

365

(4)

Chemical Vapor Deposition Basics

369

(3)

CVD Process Steps

372

(1)

CVD System Types

372

(1)

Atmospheric-Pressure CVD Systems

373

(4)

Low-Pressure Chemical Vapor Deposition (LPCVD)

377

(4)

Atomic Layer Deposition (ALD)

381

(1)

Vapor Phase Epitaxy (VPE)

382

(1)

Molecular Beam Epitaxy (MBE)

383

(1)

Metalorganic CVD (MOCVD)

384

(1)

Deposited Films

385

(1)

Deposited Semiconductors

385

(1)

Epitaxial Silicon

386

(6)

Polysilicon and Amorphous Silicon Deposition

392

(2)

SOS and SOI

394

(1)

Gallium Arsenide on Silicon

395

(1)

Insulators and Dielectrics

395

(4)

Conductors

399

(1)

Review Questions

399

(1)

References

400

(1)

Chapter 13. Metallization

401

(34)

Overview

401

(1)

Objectives

401

(1)

Introduction

402

(1)

Conductors-Single-Level Metal

402

(1)

Conductors-Multilevel Metal Schemes

403

(2)

Conductors

405

(8)

Electrochemical Plating (ECP)

413

(1)

Chemical Mechanical Processing

414

(1)

Metal Film Uses

415

(1)

Deposition Methods

416

(10)

Vacuum Pumps

426

(5)

Summary

431

(2)

Review Questions

433

(1)

References

433

(2)

Chapter 14. Process and Device Evaluation

435

(46)

Overview

435

(1)

Objectives

435

(1)

Introduction

436

(1)

Wafer Electrical Measurements

437

(2)

Process and Device Evaluation

439

(3)

Physical Measurement Methods

442

(1)

Layer Thickness Measurements

443

(5)

Junction Depth

448

(6)

Contamination and Defect Detection

454

(8)

General Surface Characterization

462

(3)

Contamination Identification

465

(2)

Device Electrical Measurements

467

(10)

Review Questions

477

(1)

References

478

(3)

Chapter 15. The Business of Wafer Fabrication

481

(32)

Overview

481

(1)

Objectives

481

(3)

Wafer Fabrication Costs

484

(7)

Equipment

491

(3)

Automation

494

(3)

Factory-Level Automation

497

(2)

Equipment Standards

499

(2)

Statistical Process Control (SPC)

501

(5)

Inventory Control

506

(2)

Quality Control and Certification-ISO 9000

508

(1)

Line Organization

508

(2)

Review Questions

510

(1)

References

510

(3)

Chapter 16. Introduction to Devices and Integrated Circuit Formation

513

(40)

Overview

513

(1)

Objectives

513

(1)

Semiconductor-Device Formation

513

(18)

Alternative (Scaled) Transistor Designs

531

(2)

Integrated-Circuit Formation

533

(10)

Bi-MOS

543

(1)

Superconductors

544

(6)

Review Questions

550

(2)

References

552

(1)

Chapter 17. Introduction to Integrated Circuits

553

(16)

Overview

553

(1)

Objectives

553

(1)

Introduction

553

(1)

Circuit Basics

554

(2)

Integrated Circuit Types

556

(10)

The Next Generation

566

(1)

Review Questions

567

(1)

References

567

(2)

Chapter 18. Packaging

569

(42)

Overview

569

(1)

Objectives

569

(1)

Introduction

569

(2)

Chip Characteristics

571

(1)

Package Functions and Design

572

(2)

Overview of Packaging Operations

574

(6)

Packaging Processes

580

(9)

Alternative Process

589

(1)

Transfer to Packaging Area

590

(10)

Package Process Flows

600

(1)

Package/Bare Die Strategies

600

(2)

Package Design

602

(6)

Package Type/Technology Summary

608

(1)

Review Questions

608

(1)

References

609

(2)

Glossary

611

(20)

Index

631

Amazon no longer offers textbook rentals. We do!

Microchip Fabrication, 5th Ed.

Microchip Fabrication, 5th Ed.

9780071432412

0071432418

Summary

Author Biography

Table of Contents

Supplemental Materials

Write a Review

Amazon no longer offers textbook rentals. We do!

Microchip Fabrication, 5th Ed.

Microchip Fabrication, 5th Ed.

9780071432412

0071432418

Summary

Author Biography

Table of Contents

Supplemental Materials

Write a Review

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