Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics...
ISBN: 9781605113128 | 1605113123
Edition: 1stFormat: Hardcover
Publisher: Cambridge Univ Pr
Pub. Date: 11/21/2011
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This volume includes selected papers from Symposium O, 'Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics', held at the April 2529, 2011 MRS Spring Meeting.
| Low-k Materials | |
| Ultra low-k materials based on self-assembled organic polymers | |
| New designs of hydrophobic and mesostructured ultra low k materials with isolated mesopores | |
| Evaluation of ultra-thin layer fabricated by wet-process as a pore-seal for porous low-k films | |
| Ozone treatment on nanoporous ultralow dielectric materials to optimize their mechanical and dielectrical properties | |
| Integration | ... MORE |
| Optimizing stressor film deposition sequence in polish rate order for best planarization | |
| Effect of chemical solutions and surface wettability on the stability of advanced porous low-k materials | |
| A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices | |
| Defects in low-ĸ insulators (ĸ=2.5âÇô2.0): ESR analysis and charge injection | |
| Patterning organic fluorescent molecules with SAM patterns | |
| Optical interconnect technologies based on silicon photonics | |
| Metallization | |
| 32nm node highly reliable Cu/low-k integration technology with CuMn alloy seed | |
| Amorphous Ta-N as a diffusion barrier for Cu metallization | |
| Comparison of TiN thin films grown on SiO2 by reactive dc magnetron sputtering and high power impulse magnetron sputtering | |
| Specific contact resistance of ohmic contacts on n-type SiC membranes | |
| Development of electrochemical copper deposition screening methodologies for next generation additive selection | |
| 3D Packaging | |
| Microbump impact on reliability and performance in through-silicon via stacks | |
| Tailoring the crystallographic texture and electrical properties of inkjet-printed interconnects for use in microelectronics | |
| Table of Contents provided by Publisher. All Rights Reserved. |
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