Vastly ahead of the field, this resource illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-package and system-level package development with a decidedly MEMS perspective. Integrating the work of international engineers, this book presents a diversity of technologies in relation to MSP. The ultimate reference on this sophisticated level of package design and techniques, it covers encapsulation and sealing and system-in-package, as well as device-level and optoelectronics packaging. It also includes coverage of modular assembly, inspection, and reliability design, with a number of real-world case studies.