Amazon no longer offers textbook rentals. We do!

Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

by: Li, Er-Ping

Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

by: Li, Er-Ping

ISBN 13:
9780470623466
ISBN 10:
0470623462
Edition: 1st
Format: Hardcover
Copyright: 04/10/2012
Publisher: Wiley-IEEE Press

Rent From $105.67

New From $150.96

List Price $152.48 Save

Rent $105.67

TERM	PRICE	DUE
SEMESTER	$105.67	Aug 02
QUARTER	$100.39	Jul 22
SHORT TERM	$95.11	Jun 22

Added Benefits of Renting

Free Shipping Both Ways
Highlight/Take Notes Like You Own It
Purchase/Extend Before Due Date

Add to Cart

List Price $152.48 Save $1.52

New $150.96

Usually Ships in 3-4 Business Days

We Buy This Book Back!

Included with your book

Free Shipping On Every Order

Add to Cart

Note: Supplemental materials are not guaranteed with Rental or Used book purchases.

Extend or Purchase Your Rental at Any Time

Need to keep your rental past your due date? At any time before your due date you can extend or purchase your rental through your account.

Summary

The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.

Foreword	p. xi
Preface	p. xiii
Introduction	p. 1
Introduction of Electronic Package Integration	p. 1
Review of Modeling Technologies	p. 6
Organization of the Book	p. 10
References	p. 11
Macromodeling of Complex Interconnects in 3D Integration	p. 16
Introduction	p. 16
Scope of macromodeling	p. 18
Macromodeling in the picture of electrical modeling of interconnects	p. 19
Network Parameters: Impedance, Admittance, and Scattering Matrices	p. 19
Impedance matrix	p. 21
Admittance matrix	p. 22
Scattering matrix	p. 23
Conversion between Z, Y, and S matrices	p. 24
Rational Function Approximation with Partial Fractions	p. 25
Introduction	p. 25
Iterative weighted linear least-squares estimator	p. 27
Vector Fitting (VF) Method	p. 29
Two steps in vector fitting method	p. 29
Fitting vectors with common poles	p. 35
Selection of initial poles	p. 37
Enhancement to the original vector fitting method	p. 38
Macromodel Synthesis	p. 41
Jordan canonical method for macromodel synthesis	p. 42
Equivalent circuits	p. 46
Stability, Causality, and Passivity of Macromodel	p. 48
Stability	p. 48
Causality	p. 50
Passivity assessment	p. 54
Passivity enforcement	p. 58
Other issues	p. 78
Macromodeling Applied to High-Speed Interconnects and Circuits	p. 79
A lumped circuit with nonlinear components	p. 79
Vertically natural capacitors (VNCAPs)	p. 83
Stripline-to-microstrip line transition with vias	p. 87
Conclusion	p. 91
References	p. 92
2.5D Simulation Method for 3D Integrated Systems	p. 97
Introduction	p. 97
Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems	p. 98
Modal expansion of fields in a parallel-plate waveguide (PPWG)	p. 98
Multiple scattering coefficients among cylindrical PEC and perfect magnetic conductor (PMC) vias	p. 101
Excitation source and network parameter extraction	p. 109
Implementation of effective matrix-vector multiplication (MVM) in linear equations	p. 117
Numerical examples for single-layer power-ground planes	p. 121
Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes	p. 127
Perfect magnetic conductor (PMC) boundary	p. 128
Frequency-dependent cylinder layer (FDCL)	p. 128
Validations of FDCL	p. 131
Numerical Simulations for Finite Structures	p. 133
Extended scattering matrix method (SMM) algorithm for finite structure simulation	p. 133
Modeling of arbitrarily shaped boundary structures	p. 139
Modeling of 3D Electronic Package Structure	p. 142
Modal expansions and boundary conditions	p. 143
Mode matching in PPWGs	p. 150
Generalized T-matrix for two-layer problem	p. 158
Formulae summary for two-layer problem	p. 164
Formulae summary for 3D structure problem	p. 169
Numerical simulations for multilayered power-ground planes with multiple vias	p. 176
Conclusion	p. 182
References	p. 183
Hybrid Integral Equation Modeling Methods for 3D Integration	p. 185
Introduction	p. 185
2D Integral Equation Equivalent Circuit (IEEC) Method	p. 186
Overview of the algorithm	p. 186
Modal decoupling inside the power distribution network (PDN)	p. 187
2D integral equation solution of parallel plate mode in power-ground planes (PGPs)	p. 189
Combinations of transmission and parallel plate modes	p. 194
Cascade connections of equivalent networks	p. 205
Simulation results	p. 214
3D Hybrid Integral Equation Method	p. 220
Overview of the algorithm	p. 220
Equivalent electromagnetic currents and dyadic green's functions	p. 224
Simulation results	p. 231
Conclusion	p. 238
References	p. 238
Systematic Microwave Network Analysis for 3D Integrated Systems	p. 241
Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair	p. 242
Introduction	p. 242
Segmentation of vias and a plate pair	p. 245
An intrinsic 3-port via circuit model	p. 248
Determination of the virtual via boundary	p. 263
Complete model for multiple vias in an irregular plate pair	p. 267
Validation and measurements	p. 269
Conclusion	p. 280
Parallel Plane Pair Model	p. 281
Introduction	p. 281
Overview of two conventional Z_pp definitions	p. 283
New Z_pp definition using the zero-order parallel plate waves	p. 285
Analytical formula for radial scattering matrix S^R_pp in a circular plate pair	p. 290
BIE method to evaluate S^R_pp for an irregular plate pair	p. 292
Numerical examples and measurements	p. 296
Conclusion	p. 303
Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias	p. 305
Introduction	p. 305
Multilayer PCB with vias and decoupling capacitors	p. 307
Systematic microwave network method	p. 308
Validations and discussion	p. 316
Conclusion	p. 324
Appendix: Properties of the Auxiliary Function W_mn(x, y)	p. 326
References	p. 327
Modeling of Through-Silicon Vias (TSV) in 3D Integration	p. 331
Introduction	p. 331
Overview of process and fabrication of TSV	p. 332
Modeling of TSV	p. 335
Equivalent Circuit Model for TSV	p. 336
Overview	p. 337
Problem statement: Two-TSV configuration	p. 338
Wideband Pi-type equivalent-circuit model	p. 339
Rigorous closed-form formulae for resistance and inductance	p. 341
Scattering parameters of two-TSV system	p. 345
Results and discussion	p. 346
MOS Capacitance Effect of TSV	p. 351
MOS capacitance effect	p. 351
Bias voltage-dependent MOS capacitance of TSVs	p. 351
Results and analysis	p. 355
Conclusion	p. 356
References	p. 358
Index	p. 361
Table of Contents provided by Ingram. All Rights Reserved.

Amazon no longer offers textbook rentals. We do!

Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

9780470623466

0470623462

Summary

Author Biography

Table of Contents

Supplemental Materials

Write a Review